Flood Box™

Available on the Nu/Clean Inline Aqueous Cleaning System

Call us: 1-800-969-7960

  • Award-winning immersion cleaning

  • Increased exposure to chemical wash liquid for better cleaning effectiveness

  • Ideal for low-standoff components and highly dense circuit designs

  • Flood Box is followed by traditional spray-in air section

  • Complete product submersion on linear conveyor system

  • Available on Nu/Clean 300 and Nu/Clean 800 series

  • Made in the USA

The Nu/Clean™ Flood Box

Electronic assemblies are becoming smaller, more densely populated, and designed with lower standoff components. All of these factors make circuit boards harder to clean. The traditional approach to overcoming these cleaning challenges has been mainly focused on chemical solutions… until now!

Technical Devices has developed the patent-pending Flood Box technology for incline cleaning. The Flood Box is a contained are within the wash section of a Nu/Clean incline cleaner where the circuit board is completely submerged, allowing the fluid to flood the board without lowering or raising the conveyor. While traveling through the Flood Box, the circuit board is simultaneously being hit with pressurized spray from nozzles and being flooded with turbulent currents of wash fluid. The Flood Box is then followed by conventional top and bottom spraying.

The Flood Box is a self-contained area, resulting in greatly reduced chemistry loss. The chemistry is not being sprayed into the air and exhausted as in traditional inline systems. The chemistry is efficiently recycled through the Flood Box, which means lower costs and easier compliance with environmental standards. Because of the innovative way the Flood Box is able to absolutely penetrate the low clearances within the electronic assembly, the amount of chemistry needed to clean assemblies may be significantly reduced. The amount of money saved on just chemistry consumption makes the Nu/Clean Flood Box Inline Cleaner the smart choice for cleaning!

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Flood Box Features

  • Proven as the best (and often only) way to clean under low-standoff components
  • Completely submerges the circuit board in kinetic wash fluid
  • Penetrates between components in densely populated circuit boards
  • Increases the amount of soak time the chemistry has, to break the surface tension and remove contaminants
  • Doubles the length of traditional wash sections so you can run at greater speeds for higher throughput
  • Greatly reduces chemistry loss as compared to spray-in air only wash systems